Startup IceMOS offers new chip interconnect technology
London based startup IceMOS offers a new through-wafer interconnect technology. Started in 2004, this startup has been offering Silicon-on-Insulate (SOI) substrates to both MEMS and IC markets. (read full story at: rds.yahoo.com)
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Startup IceMOS offers new chip interconnect technology
London based startup IceMOS offers a new through-wafer interconnect technology. Started in 2004, this startup has been offering Silicon-on-Insulate (SOI) substrates to both MEMS and IC markets. (read full story at: rds.yahoo.com)
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